App note: PCB layout guidelines for high frequency signaling products

High speed board design app note from ON Semiconductor. Link here (PDF)

There is an increase of devices and circuitry in usage of high speed, low consumption, small volume and lower interference. Hence PCB design is an important stage of electronic product design. It forms a connection between function and electronic components, and is also an important part of power circuit design. High frequency circuit has the higher integration and the higher layout density, making it necessary to know how to make layout more reliable. The use of multilayer board becomes a necessity and an effective means to reduce cross interference of signals, better grounding and lower parasitic inductance.

This application note looks at the different layout types, practices and guidelines, types of material and factors influencing the high frequency signal transfers.

from Dangerous Prototypes https://ift.tt/38B4FRV

App note: Calculating and interpreting power dissipation for polypropylene film DC-link capacitors

Tech note from Vishay on polypropylene film capacitor value calculation with temperature and power dissipation consideration. Link here (PDF)

Film capacitors can deliver high power density due to their low ESR and high ripple current capabilities, and offer the highest ampere per μF ratio of capacitor technologies. This feature, combined with their high reliability and long lifespan, make the film DC-link capacitor a central component for power inverters in industrial and automotive applications.

from Dangerous Prototypes https://ift.tt/3f1bmzh