App note: Board level application notes for DFN and QFN packages

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Board mounting an DFN/QFN (Dual/Quad Flat-Pack No lead) application note from ON Semiconductor. Link here (PDF)

The DFN/QFN platform offers a versatility which allows either a single or multiple semiconductor devices to be connected together within a leadless package. These guidelines include printed circuit board mounting pads, solder mask and stencil pattern and assembly process parameters.

from Dangerous Prototypes http://bit.ly/2XQcmgX

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